Invention Grant
- Patent Title: Extremely high frequency communication chip
- Patent Title (中): 极高频通信芯片
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Application No.: US14215069Application Date: 2014-03-17
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Publication No.: US09553616B2Publication Date: 2017-01-24
- Inventor: Gary D. McCormack , Ian A. Kyles
- Applicant: Keyssa, Inc.
- Applicant Address: US CA Campbell
- Assignee: Keyssa, Inc.
- Current Assignee: Keyssa, Inc.
- Current Assignee Address: US CA Campbell
- Agency: Fenwick & West LLP
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/44 ; H04B5/00

Abstract:
An electromagnetic Extremely High Frequency (EHF) communication chip includes one or more local oscillator circuits, a transducer circuit and at least one of a modulator or a demodulator coupled to the transducer circuit. Each of the local oscillator circuits may have a local oscillator and configured collectively to generate first and second carrier signals having respective first and second EHF frequencies. The first EHF frequency may be different than the second EHF frequency. The transducer circuit may have a first transducer for transmitting and receiving EHF communication signals. The modulator may be coupled to the local oscillator circuits for modulating the first carrier signal or the second carrier signal with a first transmit base data signal. The demodulator may be for demodulating the first carrier signal or the second carrier signal to produce a first receive base data signal.
Public/Granted literature
- US20140273894A1 EXTREMELY HIGH FREQUENCY COMMUNICATION CHIP Public/Granted day:2014-09-18
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