An apparatus for evaluating performance of a headphone assembly is provided with a base and a support having a proximal end extending from the base. The support includes a distal end that is adapted for supporting a headphone assembly, and the support includes a pair of opposing sides that are laterally spaced apart. The apparatus also includes a pair of plates and at least two microphones. Each plate is mounted to one of the opposing sides of the support, and includes a central portion with at least two apertures formed therein. The central portion is sized for receiving a headphone of the headphone assembly. Each microphone is disposed within one of the apertures and arranged such that an outer surface of the microphone is oriented substantially parallel to an outer surface of the plate and adapted for receiving sound emitted from the headphone.