Invention Grant
- Patent Title: Stretchable conductor design and methods of making
- Patent Title (中): 伸缩导体的设计和制作方法
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Application No.: US14593849Application Date: 2015-01-09
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Publication No.: US09554465B1Publication Date: 2017-01-24
- Inventor: Weifeng Liu , Anwar Mohammed , Dick Pang , Murad Kurwa
- Applicant: Flextronics AP, LLC
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Haverstock & Owens LLP
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/02 ; H05K1/03

Abstract:
A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.
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