Invention Grant
- Patent Title: Heat dissipation system
- Patent Title (中): 散热系统
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Application No.: US14185664Application Date: 2014-02-20
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Publication No.: US09554486B2Publication Date: 2017-01-24
- Inventor: Anatoly Pikovsky
- Applicant: LTX-Credence Corporation
- Applicant Address: US MA Norwood
- Assignee: Xcerra Corporation
- Current Assignee: Xcerra Corporation
- Current Assignee Address: US MA Norwood
- Agency: Holland & Knight LLP
- Agent Brian J. Colandreo; Michael T. Abramson
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
An electronic component includes a component enclosure. At least one subcomponent is positioned within the component enclosure. The at least one subcomponent is configured to be thermally coupled to the component enclosure.
Public/Granted literature
- US20140238647A1 HEAT DISSIPATION SYSTEM Public/Granted day:2014-08-28
Information query
