Invention Grant
- Patent Title: Transparent electromagnetic interference shield
- Patent Title (中): 透明电磁干扰屏蔽
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Application No.: US14552656Application Date: 2014-11-25
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Publication No.: US09554494B2Publication Date: 2017-01-24
- Inventor: Nyan-Hwa Tai , I-Ting Kuo
- Applicant: National Tsing Hua University
- Applicant Address: TW Hsinchu
- Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW103119575A 20140605
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
A transparent electromagnetic interference shield includes a first transparent substrate and an electromagnetic interference shielding layer. The electromagnetic interference shielding layer includes a transparent conductive polymer film which is formed on the first transparent substrate, and a plurality of metallic warp and weft lines which are laid on the transparent conductive polymer film. The warp lines and the weft lines cross one another.
Public/Granted literature
- US20150359147A1 TRANSPARENT ELECTROMAGNETIC INTERFERENCE SHIELD Public/Granted day:2015-12-10
Information query
