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US09558842B2 Discrete three-dimensional one-time-programmable memory 有权
离散三维一次可编程存储器

Discrete three-dimensional one-time-programmable memory
Abstract:
The present invention discloses a discrete three-dimensional one-time-programmable memory (3D-OTP). It comprises at least a 3D-array die and at least a peripheral-circuit die. At least a peripheral-circuit component of the 3D-OTP arrays is located on the peripheral-circuit die instead of the 3D-array die. The 3D-array die and the peripheral-circuit die have substantially different back-end-of-line (BEOL) structures.
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