Invention Grant
- Patent Title: Cable with resin molded body and method of manufacturing the same
- Patent Title (中): 具有树脂成型体的电缆及其制造方法
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Application No.: US14739808Application Date: 2015-06-15
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Publication No.: US09558865B2Publication Date: 2017-01-31
- Inventor: Yuta Kataoka , Yukio Ikeda
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC.
- Priority: JP2014-124434 20140617
- Main IPC: H01B7/02
- IPC: H01B7/02 ; H01B13/06 ; B29C45/14 ; B29C45/00 ; B29L31/34

Abstract:
A method of manufacturing a cable with resin molded body, wherein the cable with resin molded body includes a cable and a resin molded body formed by resin molding, wherein the resin molded body includes a main body to cover the tip portion of the cable and a flange integrally molded with the main body, and wherein the flange includes a bolt hole through which a bolt is inserted so as to fix the flange to the attachment object. The method includes molding the resin molded body by injecting a resin into a mold, the mold including a main body-molding portion for molding the main body, a flange-molding portion for molding the flange and a first resin inlet formed behind the flange-molding portion in relation to the main body-molding portion, and injecting the resin through the first resin inlet into the mold during the molding of the resin molded body.
Public/Granted literature
- US20150364230A1 CABLE WITH RESIN MOLDED BODY AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-12-17
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