Invention Grant
- Patent Title: High current power inductor
- Patent Title (中): 大功率电感
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Application No.: US14217705Application Date: 2014-03-18
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Publication No.: US09558881B2Publication Date: 2017-01-31
- Inventor: Zhuomin Liu , Robert James Bogert
- Applicant: COOPER TECHNOLOGIES COMPANY
- Applicant Address: US TX Houston
- Assignee: COOPER TECHNOLOGIES COMPANY
- Current Assignee: COOPER TECHNOLOGIES COMPANY
- Current Assignee Address: US TX Houston
- Agency: Armstrong Teasdale LLP
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/30 ; H01F17/04 ; H01F27/255 ; H01F27/28 ; H01F27/29 ; H01F3/14

Abstract:
A surface mount power inductor includes a preformed conductive winding clip and first and second-shaped core pieces. The core pieces may be configured to reduce unbalanced force experienced in the power inductor in certain types of power management circuitry. Reduction in the unbalanced force reduces vibration of the power inductor in use, and in turn reduces acoustic noise as the power inductor operates.
Public/Granted literature
- US20140313003A1 HIGH CURRENT POWER INDUCTOR Public/Granted day:2014-10-23
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