Invention Grant
- Patent Title: Passive component as thermal capacitance and heat sink
- Patent Title (中): 被动元件作为热电容和散热片
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Application No.: US13654447Application Date: 2012-10-18
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Publication No.: US09559047B2Publication Date: 2017-01-31
- Inventor: Martin Standing , Milko Paolucci
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/498 ; H01L23/367 ; H01L25/16 ; H05K1/02 ; H01L23/36 ; H05K1/18
Abstract:
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.
Public/Granted literature
- US09443798B2 Passive component as thermal capacitance and heat sink Public/Granted day:2016-09-13
Information query
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