Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14205914Application Date: 2014-03-12
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Publication No.: US09559172B2Publication Date: 2017-01-31
- Inventor: Tatsuo Shimizu , Takashi Shinohe , Johji Nishio , Chiharu Ota
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-059828 20130322
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/66 ; H01L29/739 ; H01L29/78 ; H01L29/868 ; H01L29/10 ; H01L29/167 ; H01L21/04 ; H01L29/49

Abstract:
A semiconductor device of an embodiment includes a p-type SiC impurity region containing a p-type impurity and an n-type impurity. Where the p-type impurity is an element A and the n-type impurity is an element D, the element A and the element D form a combination of Al (aluminum), Ga (gallium), or In (indium) and N (nitrogen), and/or a combination of B (boron) and P (phosphorus). The ratio of the concentration of the element D to the concentration of the element A in the above combination is higher than 0.33 but lower than 0.995, and the concentration of the element A forming part of the above combination is not lower than 1×1018 cm−3 and not higher than 1×1022 cm−3.
Public/Granted literature
- US20140284622A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-09-25
Information query
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