Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US15045218Application Date: 2016-02-16
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Publication No.: US09559195B2Publication Date: 2017-01-31
- Inventor: Akihiro Hikasa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-182168 20120821; JP2012-182169 20120821; JP2013-167477 20130812
- Main IPC: H01L29/732
- IPC: H01L29/732 ; H01L29/739 ; H01L29/66 ; H01L29/10 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/40 ; H01L29/417

Abstract:
A semiconductor device of the present invention includes a semiconductor layer, a plurality of gate trenches formed in the semiconductor layer, a gate electrode filled via a gate insulating film in the plurality of gate trenches, an n+-type emitter region, a p-type base region, and an n−-type drift region disposed, lateral to each gate trench, in order in a depth direction of the gate trench from a front surface side of the semiconductor layer, a p+-type collector region disposed on a back surface side of the semiconductor layer with respect to the n−-type drift region, an emitter trench formed between the plurality of gate trenches adjacent to each other, and a buried electrode filled via an insulating film in the emitter trench, and electrically connected with the n+-type emitter region, and the emitter trench is disposed at an interval of 2 μm or less via an n−-type drift region with the gate trench.
Public/Granted literature
- US20160211355A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-07-21
Information query
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