Invention Grant
- Patent Title: Hetero-junction semiconductor device and method of manufacturing a hetero-junction semiconductor device
- Patent Title (中): 异质结半导体器件及其制造方法
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Application No.: US15138808Application Date: 2016-04-26
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Publication No.: US09559197B2Publication Date: 2017-01-31
- Inventor: Takashi Okawa
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota
- Agency: Oliff PLC
- Priority: JP2015-101118 20150518
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/778 ; H01L29/205 ; H01L29/20 ; H01L29/06 ; H01L29/66

Abstract:
A hetero-junction semiconductor device includes: a channel layer that includes a first semiconductor; a barrier layer that is provided on the channel layer and includes a semiconductor having a band gap larger than a band gap of the first semiconductor; a source electrode and a drain electrode that are provided on the barrier layer and are ohmic contacted to the barrier layer; a p-type semiconductor layer provided on the barrier layer, the p-type semiconductor layer being provided in a region between the source electrode and the drain electrode on the barrier layer; an n-type semiconductor layer that is provided on the p-type semiconductor layer; and a gate electrode that is joined to the n-type semiconductor layer. A joint interface between the p-type semiconductor layer and the n-type semiconductor layer has a concavo-convex structure.
Public/Granted literature
- US20160343841A1 Hetero-Junction Semiconductor Device And Method of Manufacturing a Hetero-Junction Semiconductor Device Public/Granted day:2016-11-24
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