Invention Grant
- Patent Title: Integrated circuit including sensor having injection molded magnetic material
- Patent Title (中): 集成电路包括具有注塑磁性材料的传感器
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Application No.: US13594974Application Date: 2012-08-27
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Publication No.: US09559293B2Publication Date: 2017-01-31
- Inventor: Udo Ausserlechner
- Applicant: Udo Ausserlechner
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: G01R33/07
- IPC: G01R33/07 ; G01R33/09 ; H01L43/02 ; H01L43/12 ; H01L43/00
Abstract:
An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.
Public/Granted literature
- US20120319682A1 INTEGRATED CIRCUIT INCLUDING SENSOR HAVING INJECTION MOLDED MAGNETIC MATERIAL Public/Granted day:2012-12-20
Information query
