Invention Grant
- Patent Title: Encapsulation of components and a low energy circuit for hazardous locations
- Patent Title (中): 组件的封装和危险场所的低能量电路
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Application No.: US14488150Application Date: 2014-09-16
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Publication No.: US09559517B2Publication Date: 2017-01-31
- Inventor: Scott Dean Stammer , La Her , William Martin
- Applicant: Scott Dean Stammer , La Her , William Martin
- Applicant Address: US MN Anoka
- Assignee: Hoffman Enclosures, Inc.
- Current Assignee: Hoffman Enclosures, Inc.
- Current Assignee Address: US MN Anoka
- Agency: Quarles & Brady LLP
- Main IPC: H02H7/20
- IPC: H02H7/20 ; H01H9/04 ; F25B31/00 ; H01H35/26 ; H01H37/04

Abstract:
Embodiments of the disclosure provide an encapsulated compressor overload, an encapsulated compressor relay start, an encapsulated head pressure control switch and a wiring diagram for a circuit for air conditioning units which prevent gases from being ignited by means of encapsulating sparking components, use of solid-state switching devices, and/or wiring circuits in such a way that open contacts do not contain enough energy to produce a spark capable of igniting the atmosphere.
Public/Granted literature
- US20160079020A1 ENCAPSULATION OF COMPONENTS AND A LOW ENERGY CIRCUIT FOR HAZARDOUS LOCATIONS Public/Granted day:2016-03-17
Information query
IPC分类: