Invention Grant
- Patent Title: Photoelectric converting module and method for assembling same with curable adhesive
- Patent Title (中): 光电转换模块及其与可固化粘合剂的组装方法
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Application No.: US14585385Application Date: 2014-12-30
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Publication No.: US09560747B2Publication Date: 2017-01-31
- Inventor: Chih-Chen Lai
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agent Zhigang Ma
- Priority: TW102149398A 20131231
- Main IPC: H01J5/02
- IPC: H01J5/02 ; H05K1/02 ; G01J1/02 ; H05K3/30 ; H01L31/167
Abstract:
A photoelectric converting module includes a circuit board and an optical coupling member. The circuit board includes a substrate defining a plurality of heat-conducting through holes and a hot-curable adhesive layer covering the heat-conducting through holes. The optical coupling member is fixed to the substrate via the hot-curable adhesive layer.
Public/Granted literature
- US20150185070A1 PHOTOELECTRIC CONVERTING MODULE AND METHOD FOR ASSEMBLING SAME Public/Granted day:2015-07-02
Information query
