Invention Grant
US09560795B2 Bottom reception pin module for electronic component mounting device, substrate bottom reception device, and substrate bottom reception method
有权
电子部件安装装置的底部接收针模块，基板底部接收装置以及基板底部接收方法
- Patent Title: Bottom reception pin module for electronic component mounting device, substrate bottom reception device, and substrate bottom reception method
- Patent Title (中): 电子部件安装装置的底部接收针模块，基板底部接收装置以及基板底部接收方法
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Application No.: US13980140Application Date: 2012-08-02
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Publication No.: US09560795B2Publication Date: 2017-01-31
- Inventor: Shirou Yamashita , Tadashi Endo , Koji Kishita
- Applicant: Shirou Yamashita , Tadashi Endo , Koji Kishita
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2011-172781 20110808
- International Application: PCT/JP2012/004930 WO 20120802
- International Announcement: WO2013/021593 WO 20130214
- Main IPC: H05K13/00
- IPC: H05K13/00 ; H05K13/04
Abstract:
A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support the substrate includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the substrate to support the substrate. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.
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