Invention Grant
- Patent Title: Flexible grip die-alignment arrangement
- Patent Title (中): 柔性手柄芯片对准布置
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Application No.: US14544416Application Date: 2015-01-02
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Publication No.: US09561534B2Publication Date: 2017-02-07
- Inventor: Richard James Greenleaf
- Applicant: Richard James Greenleaf
- Agent Don Halgren
- Main IPC: B21D28/34
- IPC: B21D28/34 ; B26D7/26 ; B21D45/08 ; B26F1/14

Abstract:
A die press assembly for producing punched parts from a travelling web of material, the die press comprising: a lower die shoe securing a compound punch holder plate thereon, the compound punch holder biasedly gripping a compound punch tool therein, the lower die shoe also supporting a reciprocably movable stripper holder plate, wherein the compound punch extends slideably through a biasedly gripped stripper holder tool in the stripper holder plate; an upper punch holder movable with respect to the lower die shoe, the upper punch holder having a center punch holder plate which biasedly grips a center punch tool therewithin; and a die holder plate fixedly attached to the center punch holder plate with a biasedly gripped die tool slideably enclosing the center punch, wherein each of the biasedly gripped tools are in co-axial alignment in distortable bores in their respective plates.
Public/Granted literature
- US20160193747A1 Flexible grip die-alignment arrangement Public/Granted day:2016-07-07
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