Invention Grant
- Patent Title: Diffusion bonding machine and method
- Patent Title (中): 扩散粘合机及方法
-
Application No.: US13346872Application Date: 2012-01-10
-
Publication No.: US09561558B2Publication Date: 2017-02-07
- Inventor: Richard D. Trask
- Applicant: Richard D. Trask
- Applicant Address: US CT Farmington
- Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/02 ; F01D5/00

Abstract:
An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets.
Public/Granted literature
- US20130175328A1 DIFFUSION BONDING MACHINE AND METHOD Public/Granted day:2013-07-11
Information query