Invention Grant
- Patent Title: Sensor unit
- Patent Title (中): 传感器单元
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Application No.: US14425365Application Date: 2013-09-25
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Publication No.: US09561608B2Publication Date: 2017-02-07
- Inventor: Koji Kawasaki , Kazuhiro Adachi , Kyoichi Okamura
- Applicant: AISIN SEIKI KABUSHIKI KAISHA
- Applicant Address: JP Aichi
- Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-221585 20121003
- International Application: PCT/JP2013/075839 WO 20130925
- International Announcement: WO2014/054481 WO 20140410
- Main IPC: G01P3/44
- IPC: G01P3/44 ; G01D5/14 ; G01B7/30 ; B29C45/14 ; G01D11/24 ; G01P1/02 ; G01P3/487 ; G01R33/00 ; G01D5/245 ; B29C45/27 ; B29L31/00 ; B29C45/00

Abstract:
A sensor unit with a sensing surface molded properly on an outer surface of a sensor receiving part is provided. The sensor unit includes a resin casing formed with an annular fixing member, and a sensor receiving part formed in the casing for receiving a sensor housed. A sensing surface that faces a target object is formed within the sensor receiving part. A resin charging position in molding the casing is set to a position deviated circumferentially from a central position in a width of the sensing surface. In particular, resin is charged into the fixing member from a gate arranged on an extending line of a first through-bore formed in a position corresponding to the charging position.
Public/Granted literature
- US20150217495A1 SENSOR UNIT Public/Granted day:2015-08-06
Information query
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