Invention Grant
- Patent Title: Injection molding method and apparatus therefor
- Patent Title (中): 注塑方法及其设备
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Application No.: US14127362Application Date: 2012-06-22
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Publication No.: US09561610B2Publication Date: 2017-02-07
- Inventor: Atsushi Hanaoka , Kazuhiro Kawano , Suguru Nakai , Yoko Kakizaki
- Applicant: Atsushi Hanaoka , Kazuhiro Kawano , Suguru Nakai , Yoko Kakizaki
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2011-141190 20110624; JP2012-090194 20120411
- International Application: PCT/JP2012/066057 WO 20120622
- International Announcement: WO2012/176900 WO 20121227
- Main IPC: B29C45/27
- IPC: B29C45/27 ; B29C45/26 ; B29C45/28 ; B29C45/30
Abstract:
An injection molding apparatus includes an injector that obtains molten resin by melting resin, and injects the molten resin, a hot runner that is a flowing path of the molten resin, and a temperature rising part that is provided in a part of the hot runner, and increases a temperature of the molten resin to be higher than a melting temperature in the injector.
Public/Granted literature
- US20140117576A1 INJECTION MOLDING METHOD AND APPARATUS THEREFOR Public/Granted day:2014-05-01
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