Invention Grant
US09561621B2 Method and apparatus to mitigate the bond-line read-out defect in adhesive-bonded composite panels
有权
用于减轻粘合复合材料板中粘结线读出缺陷的方法和装置
- Patent Title: Method and apparatus to mitigate the bond-line read-out defect in adhesive-bonded composite panels
- Patent Title (中): 用于减轻粘合复合材料板中粘结线读出缺陷的方法和装置
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Application No.: US13540102Application Date: 2012-07-02
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Publication No.: US09561621B2Publication Date: 2017-02-07
- Inventor: Sampath K. Vanimisetti , Chen-Shih Wang
- Applicant: Sampath K. Vanimisetti , Chen-Shih Wang
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: IN578/KOL/2012 20120521
- Main IPC: B29C65/14
- IPC: B29C65/14 ; B29C65/00 ; B32B7/12 ; B29C65/48 ; B29C65/78 ; C09J5/06 ; H05B6/70 ; B32B27/08 ; B32B27/16 ; B32B27/20 ; B32B27/36 ; B32B3/04 ; F16B11/00
Abstract:
A method and apparatus to mitigate the severity of the bond-line read-out defect, and more specifically microwave heating to locally cure adhesive bond-line in a single or two stage process comprising heating thermoset adhesive with microwave radiation until the adhesive is fully cured or partially cured. If the adhesive is partially cured, it can be fully cured by being subjected to an additional thermal cycle.
Public/Granted literature
- US20130309436A1 Method And Apparatus To Mitigate The Bond-Line Read-Out Defect In Adhesive-Bonded Composite Panels Public/Granted day:2013-11-21
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