Invention Grant
- Patent Title: Element substrate and method for discharging liquid
- Patent Title (中): 元件基板和液体排出方法
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Application No.: US15050879Application Date: 2016-02-23
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Publication No.: US09561651B2Publication Date: 2017-02-07
- Inventor: Takuya Hatsui , Souta Takeuchi , Kenji Takahashi , Soichiro Nagamochi , Shinya Iwahashi
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2015-048086 20150311
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/045

Abstract:
An element substrate including a base having a heat-generating resistor element which generates thermal energy used for discharging a liquid; an electrically conductive protective layer covering the heat-generating resistor element; an insulating layer provided between the heat-generating resistor element and the protective layer; and a potential applying unit for applying a potential to the protective layer such that a potential of the protective layer is lower than a potential at one end of the heat-generating resistor element and higher than a potential at the other end of the heat-generating resistor element with a voltage being applied between the one end and the other end of the heat-generating resistor element.
Public/Granted literature
- US20160263888A1 ELEMENT SUBSTRATE AND METHOD FOR DISCHARGING LIQUID Public/Granted day:2016-09-15
Information query
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