Invention Grant
- Patent Title: Wiring harness
- Patent Title (中): 线束
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Application No.: US14515612Application Date: 2014-10-16
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Publication No.: US09561757B2Publication Date: 2017-02-07
- Inventor: Hiroyuki Yoshida , Hideomi Adachi
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-093519 20120417
- Main IPC: H02G15/02
- IPC: H02G15/02 ; B60R16/02 ; H02G3/04 ; H02G3/32

Abstract:
A wiring harness includes a conduit member which accommodates therein one or a plurality of conductor lines, and an identifying portion colored in a predetermined color and given a predetermined thickness and a non-identifying portion defined as a portion where the identifying portion is not provided circumferentially, the identifying portion and the non-identifying portion being provided on an outer surface of the conduit member. A retrofit member is attached to the non-identifying portion.
Public/Granted literature
- US20150034354A1 WIRING HARNESS Public/Granted day:2015-02-05
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