Invention Grant
- Patent Title: Chassis
- Patent Title (中): 机壳
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Application No.: US14559104Application Date: 2014-12-03
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Publication No.: US09561805B2Publication Date: 2017-02-07
- Inventor: Keith Masserang , Joshua J. Hicks , Lawrence J. Lawson , Barry A. Clark
- Applicant: Android Industries LLC
- Applicant Address: US MI Auburn Hills
- Assignee: Android Industries LLC
- Current Assignee: Android Industries LLC
- Current Assignee Address: US MI Auburn Hills
- Agency: Honigman Miller Schwartz and Cohn LLP
- Main IPC: G05B19/18
- IPC: G05B19/18 ; B61F1/00 ; B61C3/00 ; B62D65/18 ; B60L3/00 ; B60L3/04 ; B61F1/08 ; B61F5/52 ; B60K1/00
Abstract:
A chassis front assembly, a chassis rear assembly and a chassis intermediate assembly are disclosed. The chassis front assembly and the chassis rear assembly are connected to the chassis intermediate assembly for forming a chassis. A kit is also disclosed. A method is also disclosed.
Public/Granted literature
- US20150090149A1 Chassis Public/Granted day:2015-04-02
Information query
IPC分类:
