Invention Grant
US09562179B2 Adhesive composition, adhesive sheet and production process for semiconductor device
有权
粘合剂组合物，粘合片和半导体器件的生产工艺
- Patent Title: Adhesive composition, adhesive sheet and production process for semiconductor device
- Patent Title (中): 粘合剂组合物，粘合片和半导体器件的生产工艺
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Application No.: US14868421Application Date: 2015-09-29
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Publication No.: US09562179B2Publication Date: 2017-02-07
- Inventor: Naoya Saiki , Isao Ichikawa , Hironori Shizuhata , Osamu Yamazaki
- Applicant: Lintec Corporation
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: JP2006-319230 20061127; JP2006-319231 20061127
- Main IPC: C09J133/08
- IPC: C09J133/08 ; C09J163/10 ; C08L33/08 ; C08L63/10 ; C08L63/00 ; C08K5/07 ; C08K5/103 ; C08K5/29 ; C08K5/00 ; H01L21/683 ; H01L23/495 ; H01L23/00
Abstract:
An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.
Public/Granted literature
- US20160017188A1 Adhesive Composition, Adhesive Sheet And Production Process For Semiconductor Device Public/Granted day:2016-01-21
Information query
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