Invention Grant
- Patent Title: Materials and methods for thermal and electrical conductivity
- Patent Title (中): 导热和导电材料和方法
-
Application No.: US13508183Application Date: 2010-11-05
-
Publication No.: US09562284B2Publication Date: 2017-02-07
- Inventor: Ali Dhinojwala , Sunny Sethi
- Applicant: Ali Dhinojwala , Sunny Sethi
- Applicant Address: US OH Akron
- Assignee: The University of Akron
- Current Assignee: The University of Akron
- Current Assignee Address: US OH Akron
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- International Application: PCT/US2010/055677 WO 20101105
- International Announcement: WO2011/057105 WO 20110512
- Main IPC: B32B9/00
- IPC: B32B9/00 ; C23C16/26 ; B82Y30/00 ; C23C16/01 ; C23C16/56 ; H01L23/373

Abstract:
A method of implementing a carbon nanotube thermal interface material onto a heat sink that includes growing carbon nanotubes on said heat sink by chemical vapor deposition and compressing the carbon nanotubes onto metallic surfaces to increase a contact surface area between the carbon nanotubes and the metallic surfaces. The increase in the contact surface area is the area of the carbon nanotubes that is in contact with the metallic surfaces.
Public/Granted literature
- US20120231270A1 MATERIALS AND METHODS FOR THERMAL AND ELECTRICAL CONDUCTIVITY Public/Granted day:2012-09-13
Information query