Invention Grant
- Patent Title: Sulfonamide based polymers for copper electroplating
- Patent Title (中): 用于铜电镀的磺酰胺基聚合物
-
Application No.: US14980562Application Date: 2015-12-28
-
Publication No.: US09562300B2Publication Date: 2017-02-07
- Inventor: Weijing Lu , Zuhra I Niazimbetova , Maria Anna Rzeznik
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Main IPC: C25D3/58
- IPC: C25D3/58 ; C25D3/38 ; C25D5/38 ; H05K3/18
Abstract:
Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
Public/Granted literature
- US20160186349A1 SULFONAMIDE BASED POLYMERS FOR COPPER ELECTROPLATING Public/Granted day:2016-06-30
Information query
