Invention Grant
- Patent Title: Band clip, band-clip-equipped wire harness, and assembly
- Patent Title (中): 带夹,带夹线束和组装
-
Application No.: US14779450Application Date: 2014-03-24
-
Publication No.: US09562629B2Publication Date: 2017-02-07
- Inventor: Yasuhiro Kajiwara , Eriko Murata
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2013-083744 20130412
- International Application: PCT/JP2014/057982 WO 20140324
- International Announcement: WO2014/167987 WO 20141016
- Main IPC: B60R16/02
- IPC: B60R16/02 ; F16L3/137 ; H02G3/32 ; B60N3/04 ; F16B2/22

Abstract:
Provided is a band clip according to which projection from a sheet-shaped object is suppressed. The band clip includes a bundling band and a clip. The bundling band includes a head and a strap. The clip includes a button, a shaft, and a penetration inhibitor. One end of the shaft is bonded to one main surface of the button. The other end of the shaft is bonded to one main surface of the penetration inhibitor. The head is bonded to the other main surface of the penetration inhibitor. In a view from the direction in which the shaft extends, the button is larger than the shaft and the penetration inhibitor is larger than the button.
Public/Granted literature
- US20160046245A1 BAND CLIP, BAND-CLIP-EQUIPPED WIRE HARNESS, AND ASSEMBLY Public/Granted day:2016-02-18
Information query