Invention Grant
- Patent Title: Foamable filling device
- Patent Title (中): 可发泡填充装置
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Application No.: US14004621Application Date: 2012-02-21
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Publication No.: US09562642B2Publication Date: 2017-02-07
- Inventor: Koji Nomura , Hiroyuki Sakai
- Applicant: Koji Nomura , Hiroyuki Sakai
- Applicant Address: JP Aichi JP Tokyo
- Assignee: IIDA INDUSTRY CO., LTD.,HONDA MOTOR CO., LTD.
- Current Assignee: IIDA INDUSTRY CO., LTD.,HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Aichi JP Tokyo
- Agency: Renner, Otto, Boisselle and Sklar LLP
- Priority: JP2011-054653 20110311
- International Application: PCT/JP2012/054127 WO 20120221
- International Announcement: WO2012/124439 WO 20120920
- Main IPC: F16K15/03
- IPC: F16K15/03 ; F16K15/18 ; F16K1/20 ; F16K15/00 ; F16K17/00 ; F16K21/04 ; F16K15/16 ; F16L55/10 ; B29C44/58

Abstract:
Provided is a foamable filling device that includes a foamable material and is disposed within a hollow structural member. The foamable filling device includes a carrier member and an opening/closing member. The carrier member includes a through hole and a mounting portion to which the foamable material is mounted. The opening/closing member includes a cover portion formed in a size capable of blocking the through hole; and a biasing portion that biases the cover portion, and the opening/closing member is fittable to the carrier member. The opening/closing member is configured such that, when the opening/closing member is fitted to the carrier member, the biasing portion is elastically deformed and biases the cover portion to thereby bring the cover portion into contact with a seat portion provided at an end of the through hole of the carrier member.
Public/Granted literature
- US20140000739A1 FOAMABLE FILLING DEVICE Public/Granted day:2014-01-02
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