Invention Grant
- Patent Title: Conduit module coupled with heating or cooling module
- Patent Title (中): 导管模块与加热或冷却模块相连
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Application No.: US14094465Application Date: 2013-12-02
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Publication No.: US09562708B2Publication Date: 2017-02-07
- Inventor: Charles P. Medlock , Christopher P. Medlock , Jonathan A. Brock
- Applicant: WaterFurnace International, Inc.
- Applicant Address: US IN Fort Wayne
- Assignee: WATERFURNACE INTERNATIONAL, INC.
- Current Assignee: WATERFURNACE INTERNATIONAL, INC.
- Current Assignee Address: US IN Fort Wayne
- Agency: Neal, Gerber & Eisenberg LLP
- Agent Thomas E. Williams
- Main IPC: F28F27/00
- IPC: F28F27/00 ; F25B29/00 ; F25B25/00 ; F24D3/10 ; F24D3/18 ; F24D19/10

Abstract:
A heating and cooling system for use with hot, cold and source fluid circuits. A conduit module couples a heating/cooling module with the fluid circuits. The conduit module includes four three-way valves to communicated fluid from and to the fluid circuits to first and second heat exchangers in the heating/cooling module. The first heat exchanger is used to heat a fluid flow and the second one chills a second fluid flow. The conduit module simultaneously supplies a hot fluid flow to a hot fluid circuit and a cold fluid to a cold fluid circuit. The source fluid is routed by the conduit module.
Public/Granted literature
- US20140150988A1 CONDUIT MODULE COUPLED WITH HEATING OR COOLING MODULE Public/Granted day:2014-06-05
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