Invention Grant
- Patent Title: Temperature sensor structure
- Patent Title (中): 温度传感器结构
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Application No.: US13061191Application Date: 2009-08-27
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Publication No.: US09562811B2Publication Date: 2017-02-07
- Inventor: Shamus Husheer
- Applicant: Shamus Husheer
- Applicant Address: GB Cambridge
- Assignee: Cambridge Temperature Concepts Limited
- Current Assignee: Cambridge Temperature Concepts Limited
- Current Assignee Address: GB Cambridge
- Agency: Vorys, Sater, Seymour and Pease LLP
- Agent Vincent M DeLuca
- Priority: GB0815694.5 20080828
- International Application: PCT/EP2009/061096 WO 20090827
- International Announcement: WO2010/023255 WO 20100304
- Main IPC: G01K1/16
- IPC: G01K1/16 ; G01K7/42 ; G01K13/00

Abstract:
A device for measuring temperature comprising: first and second temperature sensors enclosed in a first material having one or more material components; a contact surface for contacting a body whose temperature is to be measured, at least part of the contact surface being parallel to a lateral direction; wherein the first and second temperature sensors are arranged at different depths from the contact surface and the net thermal conductivity across the device from the contact surface through the first and second temperature sensors is greater than the net lateral thermal conductivity of the device through the first and second temperature sensors.
Public/Granted literature
- US20110301493A1 Temperature Sensor Structure Public/Granted day:2011-12-08
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