A semiconductor device includes a substrate; a first through-electrode penetrating the substrate and connected to a power source or a reference potential point; a second through-electrode penetrating the substrate; a power section connected between the substrate and the second through-electrode and configured to output a DC voltage between the substrate and the second through-electrode; a voltage control section configured to control the DC voltage to be output by the power section; and a measurement section connected to the first through-electrode and configured to measure a power impedance of the first through-electrode, wherein the voltage control section is configured to control a value of the DC voltage output by the power section, such that the power impedance of the first through-electrode measured by the measurement section is equal to or less than a predetermined value within a predetermined frequency range including a frequency of noise occurring in the first through-electrode.