Invention Grant
- Patent Title: Ultrasonic-transducer mounting structure
- Patent Title (中): 超声波换能器安装结构
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Application No.: US13992671Application Date: 2011-12-09
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Publication No.: US09564116B2Publication Date: 2017-02-07
- Inventor: Takashi Tsuji , Naoya Azuma , Yasushi Nagano
- Applicant: Takashi Tsuji , Naoya Azuma , Yasushi Nagano
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-275646 20101210
- International Application: PCT/JP2011/078591 WO 20111209
- International Announcement: WO2012/077793 WO 20120614
- Main IPC: G01K11/04
- IPC: G01K11/04 ; G10K11/00 ; B60R19/48 ; G01S7/521 ; G01S15/93

Abstract:
The ultrasonic-transducer mounting structure includes: a housing including: a body part which is formed into a hollow cylindrical shape and is provided at its front surface with a transmission surface allowing an ultrasonic wave to pass therethrough and is designed to accommodate an ultrasonic transducer therein; and plural connection pieces provided to a side surface of the body part; and a holder fixed to a rear surface of a bumper and designed to hold the housing such that the transmission surface of the housing is exposed via an opening of the bumper. The holder includes plural reception pieces to which the plural connection pieces are detachably coupled respectively. The plural reception pieces are fixed to the rear surface of the bumper to surround the opening.
Public/Granted literature
- US20130250732A1 ULTRASONIC-TRANSDUCER MOUNTING STRUCTURE Public/Granted day:2013-09-26
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