Invention Grant
- Patent Title: Multi-chip package and operating method thereof
- Patent Title (中): 多芯片封装及其操作方法
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Application No.: US14963972Application Date: 2015-12-09
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Publication No.: US09564204B2Publication Date: 2017-02-07
- Inventor: Jong-Hyun Wang
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2015-0087406 20150619
- Main IPC: G11C8/12
- IPC: G11C8/12 ; G11C11/4076
Abstract:
A multi-chip package includes a plurality of semiconductor devices each having an address which is designated based on unique values corresponding to the respective semiconductor devices; and a controller suitable for activating each of the semiconductor devices based on the address, and controlling the activated semiconductor device to perform a normal operation.
Public/Granted literature
- US20160372175A1 MULTI-CHIP PACKAGE AND OPERATING METHOD THEREOF Public/Granted day:2016-12-22
Information query
