Invention Grant
- Patent Title: Semiconductor manufacturing apparatus and semiconductor device manufacturing method using the same
- Patent Title (中): 半导体制造装置及使用其的半导体装置的制造方法
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Application No.: US14543897Application Date: 2014-11-18
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Publication No.: US09564298B2Publication Date: 2017-02-07
- Inventor: Ju-hee Lee , Su-ho Lee , Won-hyuk Jang , Jae-beom Park , Ik-soo Kim , Myoung-woon Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0149997 20131204
- Main IPC: H01J37/32
- IPC: H01J37/32
Abstract:
A semiconductor manufacturing apparatus may include a chamber accommodating a substrate to be processed, a first electrode providing electric field in the chamber and a second electrode opposing to the first electrode, and a first power transmitting rod connected to one of the first electrode and the second electrode. A conductive stress attenuating unit may be formed in the first power transmitting rod. Methods of manufacturing semiconductor devices using the semiconductor manufacturing apparatus are also disclosed.
Public/Granted literature
- US20150155140A1 SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME Public/Granted day:2015-06-04
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