Invention Grant
- Patent Title: Method for improving quality of spalled material layers
- Patent Title (中): 提高剥离材料层质量的方法
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Application No.: US15046134Application Date: 2016-02-17
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Publication No.: US09564335B2Publication Date: 2017-02-07
- Inventor: Stephen W. Bedell , Keith E. Fogel , Paul A. Lauro , Ning Li , Devendra K. Sadana , Katherine L. Saenger , Ibrahim Alhomoudi
- Applicant: International Business Machines Corporation , King Abdulaziz City for Science and Technology
- Applicant Address: US NY Armonk SA Riyadh
- Assignee: International Business Machines Corporation,KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
- Current Assignee: International Business Machines Corporation,KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
- Current Assignee Address: US NY Armonk SA Riyadh
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/304 ; B26F3/00 ; H01L31/18 ; C30B33/06 ; H01L21/3205 ; H01L21/321 ; H01L21/285

Abstract:
Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.
Public/Granted literature
- US20160163553A1 METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS Public/Granted day:2016-06-09
Information query
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