Detection of lost wafer from spinning chuck

Invention Grant

US09564378B2 Detection of lost wafer from spinning chuck 有权

Title translation: 从旋转卡盘检测丢失的晶片

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Patent Title: Detection of lost wafer from spinning chuck
Patent Title (中): 从旋转卡盘检测丢失的晶片
Application No.: US14566109

Application Date: 2014-12-10
Publication No.: US09564378B2

Publication Date: 2017-02-07
Inventor: Alan D. Rose , Michael Gruenhagen
Applicant: TEL FSI, Inc.
Applicant Address: US MN Chaska
Assignee: TEL FSI, INC.
Current Assignee: TEL FSI, INC.
Current Assignee Address: US MN Chaska
Agency: Kagan Binder, PLLC
Main IPC: H01L21/84
IPC: H01L21/84 ; H01L21/66 ; H01L21/67

Detection of lost wafer from spinning chuck

Abstract:

The disclosure relates to systems and methods for detecting when a microelectronic substrate is no longer properly secured or lost from a rotating chuck. A microelectronic substrate may be secured to a rotating chuck that may rotate the substrate when exposing the substrate to the chemicals during a treatment in a process chamber. The rotating chuck may include one or more detectors to detect the position of a gripping mechanism that secure the microelectronic substrate. The detectors may generate an electrical signal that correlates to the position of the microelectronic substrate. When the electrical signal(s) exceed a threshold the system may stop rotating the chuck to prevent additional damage to the process chamber.

Abstract(Chinese):

本公开涉及用于检测何时微电子基板不再适当地固定或从旋转卡盘丢失的系统和方法。微电子衬底可以被固定到旋转卡盘，其可以在处理室中的处理期间将衬底暴露于化学物质时旋转衬底。旋转卡盘可以包括一个或多个检测器，以检测固定微电子基板的夹持机构的位置。检测器可以产生与微电子衬底的位置相关的电信号。当电信号超过阈值时，系统可能会停止旋转卡盘，以防止对处理室造成额外的损坏。

Public/Granted literature

US20160172256A1 Detection of Lost Wafer from Spinning Chuck Public/Granted day:2016-06-16

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/84	.....衬底不是半导体的，例如绝缘体