Invention Grant
- Patent Title: Via chains for defect localization
- Patent Title (中): 通过链条进行缺陷定位
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Application No.: US13943406Application Date: 2013-07-16
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Publication No.: US09564379B2Publication Date: 2017-02-07
- Inventor: Balasingham Bahierathan , Christopher B. D'Aleo , Gregory M. Johnson , Muthukumaraamy Karthikeyan , Shenzhi Yang
- Applicant: International Business Machines Corporation , STMicroelectronics, Inc.
- Applicant Address: US NY Armonk US TX Coppell
- Assignee: International Business Machines Corporation,STMicroelectronics, Inc.
- Current Assignee: International Business Machines Corporation,STMicroelectronics, Inc.
- Current Assignee Address: US NY Armonk US TX Coppell
- Agency: Gibb & Riley, LLC
- Agent Steven J. Myers, Esq.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/20 ; H01L21/66
Abstract:
Via chain and serpentine/comb test structures are in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area.
Public/Granted literature
- US20130299828A1 VIA CHAINS FOR DEFECT LOCALIZATION Public/Granted day:2013-11-14
Information query
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