Invention Grant
- Patent Title: Semiconductor device and method of forming a semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14222843Application Date: 2014-03-24
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Publication No.: US09564449B2Publication Date: 2017-02-07
- Inventor: Bernd Landgraf
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L27/115 ; H01L29/66 ; H01L29/788 ; H01L21/28 ; H01L29/94 ; H01L49/02

Abstract:
A semiconductor device is provided, which may include: a well of a first conductivity type located within a substrate of a second conductivity type; a well terminal electrically coupled to the well; a floating gate disposed over the well; a floating gate terminal electrically coupled to the floating gate; a control gate disposed over the floating gate and electrically coupled to the well; and a control gate terminal electrically coupled to the control gate; wherein the floating gate terminal is configured to receive a first voltage; wherein the control gate terminal and the well terminal are configured to receive a second voltage.
Public/Granted literature
- US20150270276A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE Public/Granted day:2015-09-24
Information query
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