Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14804290Application Date: 2015-07-20
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Publication No.: US09564466B2Publication Date: 2017-02-07
- Inventor: Takeshi Kamino , Yotaro Goto
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2014-160870 20140806
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/265 ; H01L29/66 ; H01L21/311

Abstract:
Provided is a semiconductor device with improved performance. The semiconductor device includes a photodiode having a charge storage layer (n-type semiconductor region) and a surface layer (p-type semiconductor region), and a transfer transistor having a gate electrode and a floating diffusion. The surface layer (p-type semiconductor region) of a second conductive type formed over the charge storage layer (n-type semiconductor region) of a first conductive type includes a first sub-region having a low impurity concentration, and a second sub-region having a high impurity concentration. The first sub-region is arranged closer to the floating diffusion than the second sub-region.
Public/Granted literature
- US20160043131A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-02-11
Information query
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