Invention Grant
- Patent Title: Transistor with elevated drain termination
- Patent Title (中): 具有升高的漏极端接的晶体管
-
Application No.: US14750262Application Date: 2015-06-25
-
Publication No.: US09564498B2Publication Date: 2017-02-07
- Inventor: Michael A. Briere , Reenu Garg
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/417 ; H01L29/423 ; H01L29/40 ; H01L29/78 ; H01L29/20

Abstract:
According to an exemplary implementation, a transistor includes drain finger electrodes interdigitated with source finger electrodes. The transistor also includes a current conduction path in a semiconductor substrate between the drain finger electrodes and the source finger electrodes. At least one of the drain finger electrodes has a drain finger electrode end and a drain finger electrode main body, where the drain finger electrode main body is non-coplaner with at least a portion of the drain finger electrode end. The transistor may also include a dielectric material situated between at least a portion of the drain finger electrode end and the semiconductor substrate. The dielectric material can be an increasing thickness dielectric material. The dielectric material can thus elevate the drain finger electrode end over the semiconductor substrate. Further, the drain finger electrode end can have an increased radius of curvature.
Public/Granted literature
- US20150295054A1 Transistor with Elevated Drain Termination Public/Granted day:2015-10-15
Information query
IPC分类: