Invention Grant
- Patent Title: Semiconductor device having super junction structure and method for manufacturing the same
- Patent Title (中): 具有超结结构的半导体器件及其制造方法
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Application No.: US14444861Application Date: 2014-07-28
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Publication No.: US09564515B2Publication Date: 2017-02-07
- Inventor: Jheng-Sheng You , Che-Yi Lin , Shen-Ping Wang , Kun-Ming Huang , Lieh-Chuan Chen , Po-Tao Chu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/10

Abstract:
A semiconductor device having a super junction structure includes a substrate, an epitaxial layer of a first conductivity type, a first trench, a first doped region of a second conductivity type opposite to the first conductivity type, a second trench and a second doped region of the first conductivity type. The epitaxial layer of the first conductivity type is over the substrate. The first trench is in the epitaxial layer. The first doped region of the second conductivity type is in the epitaxial layer and surrounds the first trench. The second trench is in the epitaxial layer and separated from the first trench. The second doped region of the first conductivity type is in the epitaxial layer and surrounds the second trench. The second doped region has a dopant concentration greater than a dopant concentration of the epitaxial layer. A method for manufacturing the semiconductor device is also provided.
Public/Granted literature
- US20160027874A1 SEMICONDUCTOR DEVICE HAVING SUPER JUNCTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-01-28
Information query
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