Invention Grant
- Patent Title: Array substrate and method for manufacturing the same
- Patent Title (中): 阵列基板及其制造方法
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Application No.: US14859371Application Date: 2015-09-21
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Publication No.: US09564537B2Publication Date: 2017-02-07
- Inventor: Wei-Chou Lan , Ted-Hong Shinn , Henry Wang , Chia-Chun Yeh
- Applicant: E Ink Holdings Inc.
- Applicant Address: TW Hsinchu
- Assignee: E Ink Holdings Inc.
- Current Assignee: E Ink Holdings Inc.
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., Ltd.
- Priority: TW100139964A 20111102
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/02 ; H01L21/4763 ; H01L29/49 ; H01L29/51 ; H01L29/66 ; H01L29/24 ; H01L27/12

Abstract:
Disclosed herein is a method for manufacturing an array substrate. The method includes forming a source electrode and a drain electrode on a substrate. A semiconductor layer, an organic insulating layer, and a gate electrode layer are sequentially formed to cover the substrate, the source electrode, and the drain electrode. A patterned photoresist layer is formed on the gate electrode layer. The exposed portion of the gate electrode layer, and a portion of the organic insulative layer and a portion of the semiconductor layer thereunder are removed to form a gate electrode. An organic passivation layer is formed on the gate electrode, the source electrode, and the drain electrode. The organic passivation layer has a contact window to expose a portion of the drain electrode. A pixel electrode is formed on the organic passivation layer and the exposed portion of the drain electrode.
Public/Granted literature
- US20160013322A1 ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-01-14
Information query
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