Invention Grant
US09564555B2 Opto-electronic semiconductor module and method for the production thereof 有权
光电子半导体模块及其制造方法

Opto-electronic semiconductor module and method for the production thereof
Abstract:
An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
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