Invention Grant
- Patent Title: Light emitting device package and method of fabricating the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US13790557Application Date: 2013-03-08
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Publication No.: US09564567B2Publication Date: 2017-02-07
- Inventor: Jun Seok Park , Seok Hoon Kang
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2005-0054933 20050624
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/64 ; B29C45/14 ; B29C45/34 ; H01L23/00 ; H01L33/54 ; H01L33/62
Abstract:
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
Public/Granted literature
- US20130175567A1 LIGHT EMITTING DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2013-07-11
Information query
IPC分类:
