Invention Grant
- Patent Title: Flexible LED device with wire bond free die
- Patent Title (中): 灵活的LED器件,具有无焊线自由的芯片
-
Application No.: US14859512Application Date: 2015-09-21
-
Publication No.: US09564568B2Publication Date: 2017-02-07
- Inventor: Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Johannes P. M. Kusters; Clifton F. Richardson
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L33/64 ; H01L33/48 ; H01L23/00 ; H01L33/60 ; H01L33/62 ; H05K1/18

Abstract:
An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
Public/Granted literature
- US20160049567A1 FLEXIBLE LED DEVICE WITH WIRE BOND FREE DIE Public/Granted day:2016-02-18
Information query