Invention Grant
- Patent Title: MRAM device and fabrication method
- Patent Title (中): MRAM器件及其制造方法
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Application No.: US14942502Application Date: 2015-11-16
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Publication No.: US09564577B1Publication Date: 2017-02-07
- Inventor: Chern-Yow Hsu , Shih-Chang Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/08 ; H01L43/12 ; H01L27/22

Abstract:
A magnetoresistive random access memory (MRAM) device comprises a bottom electrode over a tapered bottom via, a tapered magnetic tunnel junction (MTJ) over the bottom electrode, a top electrode over the MTJ, and a top via over the top electrode. The top via, top electrode, MTJ, bottom electrode, and bottom via (and electrical interfaces therebetween) are substantially aligned along a common vertical axis. The bottom via has a taper angle of about 120° to about 150°. The MTJ has a taper angle of about 70° to about 85°. The MTJ is isolated and protected with dual sidewall spacers.
Information query
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