Invention Grant
- Patent Title: Protection circuit module integrated cap assembly, and method of manufacturing cap assembly and secondary battery
- Patent Title (中): 保护电路模块集成盖组件,以及制造盖组件和二次电池的方法
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Application No.: US14012939Application Date: 2013-08-28
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Publication No.: US09564662B2Publication Date: 2017-02-07
- Inventor: Yu-Sik Hwang
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2013-0010094 20130129
- Main IPC: H01M10/42
- IPC: H01M10/42 ; H05K3/20 ; H01M2/04

Abstract:
A protection circuit module (PCM) integrated cap assembly includes a cap plate including an electrically conductive material and defining a through hole passing from a first surface of the cap plate to a second surface of the cap plate, a wiring unit including an electrically conductive material and a circuit pattern, and facing the first surface of the cap plate, wherein a first edge of the wiring unit is electrically coupled to the cap plate, and wherein a second edge of the wiring unit extends through the through hole of the cap plate a first insulating unit in a space of the circuit pattern a second insulating unit between the second edge of the wiring unit and a portion of the cap plate defining the through hole, and at least one electrical component coupled to the circuit pattern.
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