A terminal structure includes: a terminal portion including a tip of a covered electric wire; a connection terminal having a crimp portion crimped to the terminal portion; and a mold resin of a hygroscopic reactive type covering the terminal portion and the crimp portion. The crimp portion includes a conductive crimp portion crimped to the tip. The mold resin includes a first portion covering the conductive crimp portion and the tip; a second portion covering a part of the connection terminal which is further toward a tip than the tip, the part having a thickness smaller than the conductive crimp portion; and a first step formed between the first portion and the second portion such that the height of the mold resin decreases from the first portion to the second portion. A first recess formed on the second portion.