Invention Grant
- Patent Title: Method for manufacturing crimp terminal, crimp terminal, and wire harness
- Patent Title (中): 压接端子,压接端子和线束的制造方法
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Application No.: US14832376Application Date: 2015-08-21
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Publication No.: US09564691B2Publication Date: 2017-02-07
- Inventor: Saburo Yagi , Takashi Shigematsu , Masaya Satou , Shinya Kojima , Akira Tachibana
- Applicant: Furukawa Electric Co., Ltd. , Furukawa Automotive Systems Inc.
- Applicant Address: JP Shiga JP Tokyo
- Assignee: FURUKAWA AUTOMOTIVE SYSTEMS INC.,FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA AUTOMOTIVE SYSTEMS INC.,FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Shiga JP Tokyo
- Agency: Thompson Coburn LLP
- Priority: JP2013-033959 20130222; JP2013-257247 20131212
- Main IPC: H01R43/05
- IPC: H01R43/05 ; H01R4/18 ; B23K26/24 ; H01R43/02 ; H01R43/048 ; H01R4/20 ; H01R43/00

Abstract:
A method for manufacturing a crimp terminal having a crimp portion that allows crimp connection to a conductor part of a coated wire includes forming a tubular body by bringing together side edges of a plate material made of metal composed of a copper alloy having a copper content ratio of greater than or equal to 70%, irradiating a periphery of the sides edges, which are brought together, with laser light from a laser irradiation unit to weld the side edges which are brought together, and setting a power density of the laser light and a sweep rate of the laser light in such a manner that a weld bead formed at the side edge portion after the welding has a width of 80 μm to 390 μm.
Public/Granted literature
- US20150364837A1 Method for Manufacturing Crimp Terminal, Crimp Terminal, and Wire Harness Public/Granted day:2015-12-17
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